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Chemical Mechanical Planarization Of Microelectronic Materials

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Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials Book
Author : Joseph M. Steigerwald,Shyam P. Murarka,Ronald J. Gutmann
Publisher : John Wiley & Sons
Release : 2008-09-26
ISBN : 3527617752
File Size : 41,9 Mb
Language : En, Es, Fr and De

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Chemical Mechanical Planarization of Microelectronic Materials Book PDF/Epub Download

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

Advances in Chemical Mechanical Planarization CMP

Advances in Chemical Mechanical Planarization  CMP  Book
Author : Suryadevara Babu
Publisher : Woodhead Publishing
Release : 2021-09-24
ISBN : 0128218193
File Size : 25,9 Mb
Language : En, Es, Fr and De

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Advances in Chemical Mechanical Planarization CMP Book PDF/Epub Download

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization Book
Author : Yuzhuo Li
Publisher : John Wiley & Sons
Release : 2007-10-19
ISBN : 0471719196
File Size : 27,7 Mb
Language : En, Es, Fr and De

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Microelectronic Applications of Chemical Mechanical Planarization Book PDF/Epub Download

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Chemical Mechanical Planarization of Semiconductor Materials

Chemical Mechanical Planarization of Semiconductor Materials Book
Author : M.R. Oliver
Publisher : Springer Science & Business Media
Release : 2004-01-26
ISBN : 9783540431817
File Size : 40,7 Mb
Language : En, Es, Fr and De

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Chemical Mechanical Planarization of Semiconductor Materials Book PDF/Epub Download

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization Book
Author : Yuzhuo Li
Publisher : John Wiley & Sons
Release : 2008
ISBN : 9780471719199
File Size : 49,7 Mb
Language : En, Es, Fr and De

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Microelectronic Applications of Chemical Mechanical Planarization Book PDF/Epub Download

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: Provides in-depth coverage of a wide range of state-of-the-art technologies and applications Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Nanoparticle Engineering for Chemical Mechanical Planarization

Nanoparticle Engineering for Chemical Mechanical Planarization Book
Author : Ungyu Paik,Jea-Gun Park
Publisher : CRC Press
Release : 2019-04-15
ISBN : 1000023222
File Size : 39,6 Mb
Language : En, Es, Fr and De

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Nanoparticle Engineering for Chemical Mechanical Planarization Book PDF/Epub Download

In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.

Integrated Modeling of Chemical Mechanical Planarization for Sub Micron IC Fabrication

Integrated Modeling of Chemical Mechanical Planarization for Sub Micron IC Fabrication Book
Author : Jianfeng Luo,David A. Dornfeld
Publisher : Springer Science & Business Media
Release : 2013-03-09
ISBN : 3662079283
File Size : 33,8 Mb
Language : En, Es, Fr and De

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Integrated Modeling of Chemical Mechanical Planarization for Sub Micron IC Fabrication Book PDF/Epub Download

Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization Book
Author : Yuzhuo Li
Publisher : John Wiley & Sons
Release : 2007-12-04
ISBN : 9780470180891
File Size : 49,9 Mb
Language : En, Es, Fr and De

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Microelectronic Applications of Chemical Mechanical Planarization Book PDF/Epub Download

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect Book
Author : Jie Cheng
Publisher : Springer
Release : 2017-09-06
ISBN : 9811061653
File Size : 39,6 Mb
Language : En, Es, Fr and De

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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect Book PDF/Epub Download

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.

Chemical Mechanical Planarization VI

Chemical Mechanical Planarization VI Book
Author : Sudipta Seal
Publisher : The Electrochemical Society
Release : 2003
ISBN : 9781566774048
File Size : 26,7 Mb
Language : En, Es, Fr and De

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Chemical Mechanical Planarization VI Book PDF/Epub Download

Download Chemical Mechanical Planarization VI book written by Sudipta Seal and published by The Electrochemical Society with total hardcover pages 370 . Available in PDF, EPUB, and Kindle, read book directly with any devices anywhere and anytime.

Chemical Mechanical Polishing 9

Chemical Mechanical Polishing 9 Book
Author : G. Banerjee,K. Sundaram,V. Desai,Y. Obeng
Publisher : The Electrochemical Society
Release : 2008-05
ISBN : 1566776295
File Size : 47,9 Mb
Language : En, Es, Fr and De

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Chemical Mechanical Polishing 9 Book PDF/Epub Download

The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Chemical Mechanical Polishing 9¿, held during the 213th meeting of The Electrochemical Society, in Phoenix, Arizona from May 18-23, 2008.

Chemical Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses

Chemical Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses Book
Author : Christopher Lyle Borst,William N. Gill,Ronald J. Gutmann
Publisher : Springer Science & Business Media
Release : 2013-11-27
ISBN : 1461511658
File Size : 45,7 Mb
Language : En, Es, Fr and De

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Chemical Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses Book PDF/Epub Download

As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.

Chemical Mechanical Planarization of Semiconductor Materials

Chemical Mechanical Planarization of Semiconductor Materials Book
Author : M.R. Oliver
Publisher : Springer Science & Business Media
Release : 2013-03-14
ISBN : 3662062348
File Size : 45,6 Mb
Language : En, Es, Fr and De

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Chemical Mechanical Planarization of Semiconductor Materials Book PDF/Epub Download

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Handbook of Semiconductor Manufacturing Technology

Handbook of Semiconductor Manufacturing Technology Book
Author : Yoshio Nishi,Robert Doering
Publisher : CRC Press
Release : 2017-12-19
ISBN : 1420017667
File Size : 48,6 Mb
Language : En, Es, Fr and De

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Handbook of Semiconductor Manufacturing Technology Book PDF/Epub Download

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Chemical Mechanical Polishing 10

Chemical Mechanical Polishing 10 Book
Author : G. Banerjee
Publisher : The Electrochemical Society
Release : 2009-05
ISBN : 1566777232
File Size : 39,8 Mb
Language : En, Es, Fr and De

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Chemical Mechanical Polishing 10 Book PDF/Epub Download

The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Chemical Mechanical Polishing 10¿, held during the 215th meeting of The Electrochemical Society, in San Francisco, California from May 24 to 29, 2009.

Chemical Mechanical Planarization IV

Chemical Mechanical Planarization IV Book
Author : R. L. Opila
Publisher : The Electrochemical Society
Release : 2001
ISBN : 9781566772938
File Size : 22,9 Mb
Language : En, Es, Fr and De

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Chemical Mechanical Planarization IV Book PDF/Epub Download

Download Chemical Mechanical Planarization IV book written by R. L. Opila and published by The Electrochemical Society with total hardcover pages 350 . Available in PDF, EPUB, and Kindle, read book directly with any devices anywhere and anytime.

Abrasive Technology

Abrasive Technology Book
Author : Anna Rudawska
Publisher : BoD – Books on Demand
Release : 2018-10-24
ISBN : 1789841933
File Size : 21,9 Mb
Language : En, Es, Fr and De

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Abrasive Technology Book PDF/Epub Download

The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively.

Chemical Mechanical Planarization in IC Device Manufacturing III

Chemical Mechanical Planarization in IC Device Manufacturing III Book
Author : Robert Leon Opila
Publisher : The Electrochemical Society
Release : 2000
ISBN : 9781566772600
File Size : 31,8 Mb
Language : En, Es, Fr and De

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Chemical Mechanical Planarization in IC Device Manufacturing III Book PDF/Epub Download

This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).

Tribology In Chemical Mechanical Planarization

Tribology In Chemical Mechanical Planarization Book
Author : Hong Liang,David Craven
Publisher : CRC Press
Release : 2005-03-01
ISBN : 1420028391
File Size : 40,7 Mb
Language : En, Es, Fr and De

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Tribology In Chemical Mechanical Planarization Book PDF/Epub Download

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other focuses on the fundamentals of tribology. As the first source to integrate CMP and tribology, the book illustrates the important role that these fields play in manufacturing and technological development. It follows with an examination of tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects. Other topics covered in depth include basics of friction, flash temperature, lubrication fundamentals, basics of wear, polishing particles, and pad wear. The book concludes its focus with CMP practices, discussing mechanical aspects, pad materials, elastic modulus, and cell buckling. Expanding upon the science and technology of tribology to improve the reliability, maintenance, and wear of technical equipment and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.

Advances in Chemical Mechanical Planarization Cmp

Advances in Chemical Mechanical Planarization  Cmp  Book
Author : Suryadevara Babu
Publisher : Woodhead Publishing Limited
Release : 2016-01-12
ISBN : 9780081001653
File Size : 23,6 Mb
Language : En, Es, Fr and De

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Advances in Chemical Mechanical Planarization Cmp Book PDF/Epub Download

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Microelectronic Packaging

Microelectronic Packaging Book
Author : M. Datta,Tetsuya Osaka,J. Walter Schultze
Publisher : CRC Press
Release : 2004-12-20
ISBN : 020347368X
File Size : 42,9 Mb
Language : En, Es, Fr and De

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Microelectronic Packaging Book PDF/Epub Download

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.